Introducing Halnziye's top-tier thermal putties, the HY2612 and HY2312, rated at 12.0 W/mK and now available in India. They sit one step above the HY2610 and HY2310 (10 W/mK) and follow the same split: the Grey HY2612 is the performance-oriented compound for demanding graphics cards, workstations and gaming laptops, while the Pink HY2312 is the softer, easier-to-handle option suited to repair shops and everyday rework.
Thermal putty replaces thermal pads on GPU memory, VRMs, SSD controllers and laptop chips. Because it is shapeable it fills uneven gaps of varying thickness without any cutting or measuring, stays in place without pump-out, and is electrically non-conductive. Each jar comes with a spatula.
Note: Thermal putty is a pad replacement for memory, VRM and similar gap-filling applications, not a replacement for thermal paste on a CPU/GPU die. A 20 g jar covers roughly a full-size graphics card's memory and VRMs.
Features
- Rated thermal conductivity 12.0 W/mK (Halnziye specification)
- Grey HY2612: performance-oriented, firmer compound; Pink HY2312: softer, easier to apply and remove
- Electrically non-conductive, non-corrosive, stable at high temperatures
- Replaces thermal pads of any thickness; no cutting or measuring
- 20 g jar with spatula included
Package Includes
- Halnziye thermal putty 20 g jar x1
- Spatula x1